The rapid development of microelectronic technology, electronic computer technology, modern communication technology, optoelectronic technology and space technology has put forward new requirements for relay technology. The development of new technology and new technology will undoubtedly promote the development of relay technology.
The rapid development of microelectronic technology and ultra-large-scale IC also put forward new requirements for relays. The first is miniaturization and sheeting. Such as IC packaged military TO-5 (8.5 × 8.5 × 7.0mm) relay, it has high vibration resistance and can make the equipment more reliable; the second is combination and multi-function, which is compatible with IC and can be built-in The amplifier requires sensitivity to be raised to microwatt level; the third is full solidification. The solid relay has high sensitivity and can prevent electromagnetic interference and radio frequency interference.
The popularity of computer technology has significantly increased the demand for relays for microcomputers, and relays with microprocessors will develop rapidly. In the early 1980s, digital time relays produced in the United States could use commands to control the relays. The combination of relays and microprocessors developed to form a compact and complete control system. Computer-controlled industrial robots are currently growing at a rate of 3.5% per year. Now, the computer-controlled production system can produce a variety of low-cost relays on a production line, and can automatically complete a variety of operations and test work.
The development of communication technology has far-reaching significance for the development of relays. On the one hand, the rapid development of communication technology has increased the application of the entire relay. On the other hand, because optical fiber will be the aorta of future information society transmission, new types of relays such as fiber optic relays and reed switch fiber optic switches will appear under the impetus of fiber optic communications, optical sensing, optical computers, and optical information processing technologies.
Optoelectronic technology will have a huge role in promoting relay technology. In order to achieve reliable operation of optical computers, bistable relays have been trial-produced.
In order to improve the reliability of aviation and aerospace relays, it is expected that the relay failure rate should be reduced from the current 0.1 PPM to 0.01 PPM; the manned space station requires 0.001 PPM. The temperature resistance must be above 200 ℃, the vibration resistance requirement should be higher than 490m / s, and it should be able to withstand 2.32 × 10 (4) C / Kg α-ray radiation. In order to meet space requirements, it is necessary to strengthen reliability research and establish special high-reliability production lines.
The development of new special structural materials, new molecular materials, high-performance composite materials, optoelectronic materials, as well as oxygen-absorbing magnetic materials, temperature-sensitive magnetic materials, and amorphous soft magnetic materials are all important for the development of new magnetic holding relays, temperature relays, and electromagnetic relays. Important significance, and there will be new principles and new effects of relays.
With the improvement of micro and chip technology. The relay will develop in the direction of miniature and surface-mounting with only a few millimeters in two-dimensional and three-dimensional dimensions; the relays produced by some manufacturers in the world are only 1/4 to 1/8 of the volume 5 to 10 years ago. Because the electronic complete machine needs a smaller relay whose height does not exceed other electronic components when reducing the volume. Communication equipment manufacturers are more eager for intensive relays. The size of a BA series of ultra-dense signal relays produced by Fujitsu Takamisawa of Japan is only 14.9 (W) × 7.4 (D) × 9.7 (H) mm, which is mainly used for fax machines and The modem can withstand a fluctuating voltage of 3kV. The volume of AS series surface mount relays introduced by the company is only 14 (W) × 9 (D) × 6.5 (H) mm.
Especially in the field of power relays, safe and reliable relays are required, such as high-insulation relays. The JV series power relay launched by FujitsuTaKamisawa of Japan contains five amplifiers and adopts a high-insulation small-section design with a size of 17.5 (W) × 10 (D) × 12.5 (H) mm. As the reinforced insulation system is adopted between the movement and the outer edge, its insulation performance reaches 5kV. The power consumption of the MR82 series power relay launched by NEC in Japan is only 200mW.
Various amplification, delay, elimination of contact jitter, arc extinguishment, remote control, combinational logic and other circuits can be installed in the relay to make it have more functions. With the breakthrough of SOP technology (SmallOutlinePackage), manufacturers are likely to integrate more and more functions together. The combination of relay and microprocessor will have a wider range of specialized control functions, thus achieving high intelligence.
The rise of new technologies will promote the development of various types of relays with different principles, different performances, different structures and uses. Driven by technological advancement, demand traction, and the development of sensitive and functional materials, the performance of special relays, such as temperature, radio frequency, high voltage, high insulation, low thermal potential, and non-electric power control, will be improved daily.
Electromagnetic relays (EMR) have been in use for more than 150 years since the initial use of telephone relays. With the development of the electronics industry, especially the breakthrough of optical coupling technology in the early 1970s, solid-state relays (SSR, also known as electronic relays) have sprung up. Compared with traditional relays, it has the advantages of long life, simple structure, light weight and reliable performance. Solid-state relays have no mechanical switches, and have important characteristics such as high compatibility with microprocessors, high speed, shock resistance, vibration resistance, and low leakage. At the same time, because this product has no mechanical contacts, it does not generate electromagnetic noise, so no additional components such as resistors and capacitors are needed to keep silent. Traditional relays require these additional components. Therefore, traditional relays are often cumbersome, complicated, and costly.
In the future, the focus of the small sealed relay market development will be TO-5 relays and 1/2 crystal cover relays compatible with ICs. Military relays will accelerate the shift to industrial / commercialization. US military relays account for about 20% of the total relays. The general relay market continues to develop towards small, thin and plastic packages. Relays for small printed boards will continue to be the mainstream product in the general relay market. Solid-state relays will become more widespread and prices will continue to fall, moving closer to high reliability, small size, high resistance to surge current impact and anti-interference. The reed relay market will continue to expand. The application fields and demand of surface mount relays will increase.